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CMP Slurry

The PLANERLITE series of polishing slurries is intended for use in chemical mechanical planarization (CMP), a key planarization process in the fabrication of high-density ultra large scale integration (ULSI) devices. It has been developed under the basic concepts of high purity, high removal rate, high dispersion and scratch-free performance.



・PLANERLITE-4000 series
This polishing slurry is designed for use on SiO2 films (inter-layer dielectric, shallow trench isolation), and is based on ultrapure colloidal silica or fumed silica.

・PLANERLITE-6000 series
This polishing slurry is designed for use with polisilicon. There is a variety of types available, either polishing slurry based on ultrapure colloidal silica or rinsing agent with special additives which keeps the post-polishing wafer surface hydrophilic.

・PLANERLITE-7000 series
This polishing slurry is designed specifically for copper (Cu) metallization in the damascene process. Based on ultrapure colloidal silica with special additives, it delivers high copper removal rate, with excellent selectivity to barrier metal.

・PLANERLITE-8000 series
This polishing slurry is specifically for the barrier metals and comprises two varreties. one that polishes the ILD and one that does not.



Download the Data Sheet (873kb)

 
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